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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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MEMS Substrate
Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
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1 - 3 of 3
MEMS Substrate
Horexs Ultra thin MEMS package substrate manufacture supporting
Ultrathin MEMS PCB which have Capacitor and Resistor in it Application:MEMS semiconductor,MEMS package,MEMS,CMOS,IC substrate,acoustics electronics...
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0.2mm Ultrathin MEMS packaging substrate fabrication for microphoneµelectronics
Ultrathin High Quality MEMS PCB for Microphone Application:MEMS,sensor MEMS package,semiconductors,bonding pcb,Microelectronics package; Spec.of ...
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OEM ODM BT Material MEMS/CMOS Substrate Multilayer substrate manufacture
Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate.....
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