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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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IC Package Substrate

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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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1 - 10 of 47

 IC Package Substrate
China Hitachi BT IC Package Substrate production supporting for sale

Hitachi BT IC Package Substrate production supporting

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ...
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China AUS308 PSR IC Package substrate manufacture for sale

AUS308 PSR IC Package substrate manufacture

Application:UDP memory card,TF card,Memory card,SD card ,IC substrate pcb board;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate...
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China Precision 0.15mm IC Packaging Substrate fabrication for sale

Precision 0.15mm IC Packaging Substrate fabrication

Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR....
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China 0.15mm IC assembly package substrate For semiconductor package for sale

0.15mm IC assembly package substrate For semiconductor package

Application:IC card,BANK card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR....
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China Hitachi brand BT material substrate manufacture for sale

Hitachi brand BT material substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ...
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China 4L build up types 0.8mm Gold Surface IC Package Substrate for sale

4L build up types 0.8mm Gold Surface IC Package Substrate

Application:Dram memory electronics,IC card,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC ...
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China Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation for sale

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics...
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China Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR for sale

Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR

Application: Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD ...
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China JEDEC Standard eMCP IC Package Substrate Fabrication for sale

JEDEC Standard eMCP IC Package Substrate Fabrication

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card...
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China FCBGA/BGA package substrate manufacture for sale

FCBGA/BGA package substrate manufacture

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS....
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