HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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Memory Substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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 Memory Substrate

FMC NAND / Flash Memory Substrate BT / FR4 Material 70um For Memory Cards

FMC NAND/Flash memory substrate manufacture supporting Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash ...
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wirebonding packaging memory substrate with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,UDP/USB memory products others; Spec.of substrate production: Mini.....
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4L SD card memory substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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0.26mm memory substrate fabrication with soft gold plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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NAND memory package substrate manufacture

Application:NAND memory package,Memory electronics,storage electronics,Flash memory,FBGA/PBGA package,Semiconductor package; Spec.of pcb production: ....
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UDP/USB memory substrate manufacture supporting

Application:IC package,Semiconductor package,UDP/USB products,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space...
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wire bonding memory substrate with gold plating manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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13 years experience of Nand/Flash memory substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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MGC BT Memory substrate 4L with ENEPIG plating

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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0.2mm 4L BT memory substrate manufacture JEDEC standard

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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