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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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Sip Package Substrate

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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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 Sip Package Substrate
China Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System for sale

Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System

stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with ...
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China Sip package substrate BT material 4 layer ENEPIG for sale

Sip package substrate BT material 4 layer ENEPIG

Application:Semiconductor,IC package,IC substrate,wearable electronics,IC assembly,Storage IC substrage; Spec.of Substrate production: Mini.Line space...
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China Anylayer/Buildup types Sip packaging Substrate manufacture for sale

Anylayer/Buildup types Sip packaging Substrate manufacture

Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness....
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