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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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1 - 10 of 140

 Products
China FR4 core memory ic substrate manufacture for sale

FR4 core memory ic substrate manufacture

Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 ...
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China Ultrathin Rigid PCB manufacture for microelectronics assembly for sale

Ultrathin Rigid PCB manufacture for microelectronics assembly

Description Of IC Substrate pcb Microelectronics electronics IC substrate is a type of carry material for integrated circuit with internal circuit to ...
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China Gold Plated 0.1mm 0.4mm Thickness Rigid Fr4 PCB Circuit Board for sale

Gold Plated 0.1mm 0.4mm Thickness Rigid Fr4 PCB Circuit Board

Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
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China NAND memory substrate ultrathin FR4 core BT raw material for sale

NAND memory substrate ultrathin FR4 core BT raw material

Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
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China SIM Card Smart card pcb manufacture with ultrathin core for sale

SIM Card Smart card pcb manufacture with ultrathin core

Description Of IC Substrate pcb Sim card or Smart card is usually use for bank card ,IoT industry,Smart home electronics,It required lower cost ...
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China BT semiconductor IC packaging substrate manufacture for sale

BT semiconductor IC packaging substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ...
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China Flash/NAND memory package substrate production for sale

Flash/NAND memory package substrate production

Application:Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC ...
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China Multilayer BT materials semiconductor package substrate manufacture for sale

Multilayer BT materials semiconductor package substrate manufacture

Application:Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ...
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China CMOS sensors ic package manufacture supporting for sale

CMOS sensors ic package manufacture supporting

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,telecommunication electronics,consumer electronics,Storage IC substrage...
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China 0.28mm Finished Lead Free memory chip substrate manufacture for sale

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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