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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
7 Years
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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [6]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [20]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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1 - 10 of 137

 Products
China FR4 core memory ic substrate manufacture for sale

FR4 core memory ic substrate manufacture

Description Of IC Substrate pcb Above IC substrate is a type of memory chip ic package substrate,Which is widely use for memory card,High tg FR4 ...
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China Ultrathin Rigid PCB manufacture for microelectronics assembly for sale

Ultrathin Rigid PCB manufacture for microelectronics assembly

Description Of IC Substrate pcb Microelectronics electronics IC substrate is a type of carry material for integrated circuit with internal circuit to ...
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China Gold Plated 0.1mm 0.4mm Thickness Rigid Fr4 PCB Circuit Board for sale

Gold Plated 0.1mm 0.4mm Thickness Rigid Fr4 PCB Circuit Board

Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
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China NAND memory substrate ultrathin FR4 core BT raw material for sale

NAND memory substrate ultrathin FR4 core BT raw material

Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
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China SIM Card Smart card pcb manufacture with ultrathin core for sale

SIM Card Smart card pcb manufacture with ultrathin core

Description Of IC Substrate pcb Sim card or Smart card is usually use for bank card ,IoT industry,Smart home electronics,It required lower cost ...
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China 0.28mm Finished Lead Free memory chip substrate manufacture for sale

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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China OEM ODM semiconductor packaging substrate China mainland for sale

OEM ODM semiconductor packaging substrate China mainland

Application:LED keyboards electronics,consumer electronics,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; ...
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China 0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate for sale

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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China RF/mmwave module substrate manufacture for sale

RF/mmwave module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ...
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China microelectronics package substrate manufacture for sale

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ...
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