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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
6 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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IoT Substrate
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BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
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1 - 3 of 3
IoT Substrate
QFN package sensors substrate manufacture supporting
Application:Semiconductor package,Sensors electronics package,QFN package,Sensors electronics,Smart electronics; Spec.of Substrate production: Mini...
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BGA/QFN package substrate production for IoT industry semiconductor
Application:Smart electronics,Smart healthy electronics,Smart agricultural electronics,IoT industry electronics,Smart express electronics ,others; ...
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Camera Module substrate manufacture supporting China
Application:Camera modules electronics,modules electronics,Consumer electronics,Sensors electronics,Semiconductor package; Spec.of pcb production: ...
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