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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
6 Years
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FCCSP Package Substrate

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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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1 - 8 of 8

 FCCSP Package Substrate
China semiconductor FCCSP Package Substrate manufacture for sale

semiconductor FCCSP Package Substrate manufacture

Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ....
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China BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly for sale

BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal ...
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China 0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material for sale

0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
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China BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly for sale

BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
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China Flip Chip CSP Package Substrate 5x5mm Green Color BT Material for sale

Flip Chip CSP Package Substrate 5x5mm Green Color BT Material

Flip Chip CSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor ...
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China High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR for sale

High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR

PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & .....
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China FCCSP package substrate 4L Buildup types ENEPIG for sale

FCCSP package substrate 4L Buildup types ENEPIG

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
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China FCCSP substrate manufacture supporting China for sale

FCCSP substrate manufacture supporting China

Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil .....
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