HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
6 Years
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FCCSP Package Substrate

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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 FCCSP Package Substrate

semiconductor FCCSP Package Substrate manufacture

Application:FCCSP package,IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line ....
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal ...
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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly

FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
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FCCSP package substrate 4L Buildup types ENEPIG

Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
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FCCSP substrate manufacture supporting China

Application:Consumer electronics,Internet electronics,telcommunication electronics,Others; Spec.of Substrate production: Mini.Line space/width:1mil .....
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