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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate

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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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1 - 10 of 25

 BGA Substrate
China 0.28mm Finished Lead Free memory chip substrate manufacture for sale

0.28mm Finished Lead Free memory chip substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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China OEM ODM semiconductor packaging substrate China mainland for sale

OEM ODM semiconductor packaging substrate China mainland

Application:LED keyboards electronics,consumer electronics,telecom.electronics;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; ...
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China 0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate for sale

0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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China RF/mmwave module substrate manufacture for sale

RF/mmwave module substrate manufacture

Application:IC package,Microelectronics devices,Microelectronics assembly,Microelectronics package,Semiconductor package,Memory electronics,NAND/Flash ...
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China microelectronics package substrate manufacture for sale

microelectronics package substrate manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory,Microelectronics assembly,Microelectronics package; Spec.of ...
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China L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL for sale

L/S 30um BT Wire Bonding Substrate ENEPIG / ENIG Hard Gold Soft Gold UL

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
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China MGC brand BT CSP package Substrate Fabrication for sale

MGC brand BT CSP package Substrate Fabrication

Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
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China BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface for sale

BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface

MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ....
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China BT material semiconductor Pacakge Substrate L/S 35/35um for sale

BT material semiconductor Pacakge Substrate L/S 35/35um

BOC pacakge substrate manufacture with short delivery time Application:Memory package,Memory packaging substrate,Dram/LPDDR/DDR package substrate...
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China ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate for sale

ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate

COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct...
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