HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
Home / Products / MEMS Substrate /

OEM ODM BT Material MEMS/CMOS Substrate Multilayer substrate manufacture

Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
Visit Website
City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
Contact Now

OEM ODM BT Material MEMS/CMOS Substrate Multilayer substrate manufacture

Ask Latest Price
Brand Name :Horexs
Certification :UL
Place of Origin :china
MOQ :1 square meter
Price :US 120-150 per square meter
Payment Terms :L/C, D/P, T/T, Western Union, MoneyGram
Supply Ability :30000 square meters per month
Delivery Time :7-10 working days
Packaging Details :carton customized
Layers :2L
Material :BT
SR :Taiyo
Color :Black
Thickness :0.2mm
Line Width :50um
Line Space :40um
Pitch :60um
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Ultrathin MEMS PCB use OhmegaPly Cooper Foil and Mitsui Core Material

Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,EMMC,CMOS,MEMS,IC assembly,Storage IC substrage;

Spec.of Substrate production:

Mini.Line space/width:1mil (25um)

Finished thickness:BT (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

OEM ODM BT Material MEMS/CMOS Substrate Multilayer substrate manufacture

Short introduction of Horexs Manufacturer:

HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which invested more than 300 million USD. IC Substrate Capacity 600,000SQM/Year,Tenting&SAP process. HOREXS-Hubei is committed to the development of IC substrate in China, striving to become one of the top three IC substrate manufacturers in China, and striving to become a world-class IC board manufacturer in the world . Technology like L/S 20/20un,10/10um.BT+ABF materials. Support: Wire bonding Substrate Wire bonding(BGA) Substrate Embedded (Memor y IC substrate) MEMS/CMOS,Module(RF,Wireless ,Bluetooth) 2/4/6L (1+2+1/2+2+2/1+4+1),Buildup(Buried/Blind hole) Flipchip CSP; Others ultra ic package substrate.

When you send inquiry us,Pls be know that we have to get the following :

1-Substrate production sepc. information;

2-Gerber files(Substrate designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-Multilayer Substrate,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality Substrate ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)


Inquiry Cart 0