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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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5 Years
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Home / Products / IC Package Substrate / Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
  • Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
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BOC package substrate manufacture supporting BOC (Board on Chip) BOC is the substrate that connects bonding pad on substrate to the bonding pad of ...
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smd pcb smt pcb pcb smd

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