HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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5 Years
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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

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Brand Name :Horexs
Certification :UL
Place of Origin :CHINA
MOQ :1 square meter
Price :US 120-150 per square meter
Payment Terms :Western Union, MoneyGram, T/T, L/C
Supply Ability :30000 square meters per month
Delivery Time :7-10 working days
Packaging Details :carton customized
package :BOC
finished :soft gold
core :40um,39um
L/S :35/35um(MP)
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BOC package substrate manufacture supporting

BOC (Board on Chip)
BOC is the substrate that connects bonding pad on substrate to the bonding pad of chip by using wire-bonding through the central slot.
It has the bonding and solder side of the substrate in one plane. It replaced the previous lead frame into laminated substrate, which enables I/O pins to diversify and chip to stack vertically, thus it is widely used in memory chip as it is easy to achieve high speed & high density.

Application:Semi Package,Semiconductors,Desktop & Notebook PC, Server, SSD, Graphic Cards ,Semiconductor,IC package,IC substrate,Smart phone, Tablet, IoT devices, Infotainment system, Notebook PC, etc,IC assembly,Storage IC substrage;

Spec.of pcb production:

Mini.Line space/width:1mil (35um)

Finished thickness:BT/FR4 (0.1-0.4mm) finished thickness;

Material brand:Mainly brand:SHENGYI,Mitsubishi(BT-FR4),mitsuiseiki,OhmegaPly,Ticer,AMC,Isola,AGC,Neclo,Rogers,Taconic,Others;

Surface finished:Mainly immersion gold,support customize such as OSP/Immersion silver,tin,more;

Copper:0.5oz or Customize;

Layer:1-6 layer (Customize);

Soldermask:Green or Customize (Brand:Soldermask:TAIYO INK,ABQ)

Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip

Short introduction of Horexs Manufacturer:

HOREXS is whole process ultra thin FR4 PCB manufacturer in CHINA,It's also one of the famous thin FR4 PCB (IC Susbtrate ) manufacturers in CHINA,which has AVI,AOI for checking,3 LDI for soldermask and circuit line,Mekki brand laminate press machines,Quality yield more than 99.7%,quite Stable quality guaratnee! Welcome to visit us to check it too!

Almost of Horexs production machines are from Japan,high precision for production,It's also the reason of stable quality guarantee!

Welcome contact Horexs to produce your design/your idea/your pcb boards ,your layout desing.

Horexs's Products are widely used in IC assembly/IC substrate package, smart card, IC card, Micro SD,Sensor package, eMMC,BGA,UFS,eMCP,uMCP,DDR4,MEMS, small TF card, SD card, SIM card, high voltage circuit breaker, a tablet computer, electronic antenna, tag, microphone, 3D optical technique.

When you send inquiry us,Pls be know that we have to get the following :

1-PCB production sepc. information;

2-Gerber files(PCB designer/engineer can export it from your layout software,also send us drilling file)

3-Quantity request,Including sample;

4-For multilayer thin FR4 PCB,please also provide us layer stack-up information;

Finally,If you are very big customers,Pls also let's know the details of your demand,Horexs also can support your technical supporting if you need!HOREXS 's mission is that help you save cost with same high quality guarantee!

Want Better price,Better quality pcb ? Contact Horexs now!

Shipping supporting:

DHL/UPS/Fedex;

By air;

Customize express(DHL/UPS/Fedex)

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