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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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6 Years
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Home / Products / IC Package Substrate / High-Performance SiP Package Substrate for IoT Electronics /

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BGA Substrate

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IC Package Substrate

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Sip Package Substrate

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FCCSP Package Substrate

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RF Module Substrate

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Memory Substrate

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MEMS Substrate

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IoT Substrate

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Other Ultrathin Substrate

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Ultrathin Rigid PCB

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Medical Equipment PCB

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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High-Performance SiP Package Substrate for IoT Electronics
High-Performance SiP Package Substrate for IoT Electronics
  • High-Performance SiP Package Substrate for IoT Electronics
Products Detailed
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS...
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Product Tags:
sip technology ic package substrate wafer carrier

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