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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
6 Years
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Home / Products / FCCSP Package Substrate / 0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
  • 0.3mm FCCSP Package Substrate 4L Buildup Types ENEPIG 5*5mm BT Material
Products Detailed
Application:IC assembly,Semiconductor package,IC package,Consumer electronics,Computer,others; Spec.of Substrate production: Mini.Line space/width...
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