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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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6 Years
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Home / Products / FCCSP Package Substrate / BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
  • BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
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FCCSP package substrate production supporting Product description IC substrate is a type of carry material for integrated circuit with internal ...
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