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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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IC Package Substrate
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Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom
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Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
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Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom
Products Detailed
Product description IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBS. Additionally, ...
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