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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / IC Package Substrate / EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
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EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
  • EMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4 Material
Products Detailed
eMMC IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support ...
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