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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / IC Package Substrate / Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness /

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Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
  • Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
Products Detailed
Soft gold MCP/CSP package substrate manufacture supporting MCP (Multi-Chip Package) MCP is the structure that increases memory capacity and performanc...
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Product Tags:
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