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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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Home / Products / FCCSP Package Substrate / High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR
High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR
  • High-Performance FCCSP/FCBOC Package Substrate for PC/Server DRAM and SRAM/LPDDR
Products Detailed
PBGA / CSP package substrate production supporting Application:IC assembly,Smart Mobile Devices, Notebook PC, video cameras, PLDs,Microprocessors & ...
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Product Tags:
free hasl pcb ic package substrate fr4 pcb full form

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