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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / Sip Package Substrate / Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System /

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Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
  • Stack Via / Via Filling Sip Package Substrate BT Material 4L Combine Heterogenous System
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stack via/via filling Sip package substrate production supporting SiP (System in Package) SiP is the substrate that enables active devices with ...
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