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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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6 Years
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Home / Products / FCCSP Package Substrate / BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
  • BT FCCSP Package Substrate 3x3mm Green Color For Flip Chip Assembly
Products Detailed
FCCSP package substrate production supporting Application:IC assembly,Mobile phone,Smart phone,Digital camera electronics,Semiconductor package,IC ...
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Product Tags:
customized fr4 pcb fr4 design pcb protel pcb design software

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