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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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BT material BGA semiconductor package Substrate production
BT material BGA semiconductor package Substrate production
  • BT material BGA semiconductor package Substrate production
Products Detailed
All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconduct...
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