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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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5 Years
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BGA Substrate

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IC Package Substrate

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Sip Package Substrate

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FCCSP Package Substrate

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Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
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4 Layer buildup types semiconductor Package Substrate production
4 Layer buildup types semiconductor Package Substrate production
  • 4 Layer buildup types semiconductor Package Substrate production
Products Detailed
POP Package Substrate Memory EMMC Substrate Production Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate...
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