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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / BGA Substrate / ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
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ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate
ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate
  • ENEPIG ENIG Soft Gold Package Substrate Customize 1-6 Layer BT Substrate
Products Detailed
COB package substrate manufacture with lower cost China Application:Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconduct...
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