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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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6 Years
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Home / Products / BGA Substrate / BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface /

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BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface
BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface
  • BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface
Products Detailed
MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you ...
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