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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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MGC brand BT CSP package Substrate Fabrication
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Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
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MGC brand BT CSP package Substrate Fabrication
Products Detailed
Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Spec.of substrate production: Mini.Line ...
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