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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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Home / Products / BGA Substrate / BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness /

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BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness
BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness
  • BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness
Products Detailed
Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0...
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