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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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Home / Products / BGA Substrate / BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting /

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BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting
BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting
  • BT FR4 4 Layer CSP Substrate ENEPIG Improved Tenting
Products Detailed
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/LPDDR package substrate,Semiconductor ...
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