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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / BGA Substrate / ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
  • ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
Products Detailed
Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package...
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