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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / BGA Substrate / ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
  • ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
Products Detailed
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics...
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