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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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Home / Products / IC Package Substrate / FBGA/PBGA/LGA Package Semiconductor Substrate manufacture /

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BGA Substrate

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IC Package Substrate

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Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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FBGA/PBGA/LGA Package Semiconductor Substrate manufacture
FBGA/PBGA/LGA Package Semiconductor Substrate manufacture
  • FBGA/PBGA/LGA Package Semiconductor Substrate manufacture
Products Detailed
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
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