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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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6 Years
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Home / Products / IC Package Substrate / line/space 25um FBGA Package Substrate For Memory ic packaging /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
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line/space 25um FBGA Package Substrate For Memory ic packaging
line/space 25um FBGA Package Substrate For Memory ic packaging
  • line/space 25um FBGA Package Substrate For Memory ic packaging
Products Detailed
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
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