HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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6 Years
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4layer BT material Sip Packaging Substrate Semiconductor package

4layer BT material Sip Packaging Substrate Semiconductor package
  • 4layer BT material Sip Packaging Substrate Semiconductor package
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
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