Products Suppliers Sign in Register

HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quota
English
Home / Products / IC Package Substrate / Tenting process 25um DRAM IC package Substrate BT material 4 Layer /

show pictures

Product Categories

BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
Visit Website
City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
View Contact Details
Contact Now

Tenting process 25um DRAM IC package Substrate BT material 4 Layer
Tenting process 25um DRAM IC package Substrate BT material 4 Layer
  • Tenting process 25um DRAM IC package Substrate BT material 4 Layer
Products Detailed
Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -...
View Products Detailed →

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4