Products
Suppliers
Sign in
Register
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
6 Years
Home
Products Catalog
Company Profile
Quality Control
Contact Us
Request a Quota
English
Français
Русский язык
Español
日本語
Português
BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
Home
/
Products
/
Sip Package Substrate
/
Anylayer/Buildup types Sip packaging Substrate manufacture
/
show pictures
Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
Visit Website
City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
View Contact Details
Contact Now
Anylayer/Buildup types Sip packaging Substrate manufacture
Products Detailed
Application:Wearable electronics/Memory/DSP/ASIC/CPU/IoT industry; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness...
View Products Detailed →
Product Tags:
membrane manufacture
plastic additives suppliers
buy flexible substrate