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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
6 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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MEMS Substrate
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Horexs Ultra thin MEMS package substrate manufacture supporting
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Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
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Horexs Ultra thin MEMS package substrate manufacture supporting
Products Detailed
Ultrathin MEMS PCB which have Capacitor and Resistor in it Application:MEMS semiconductor,MEMS package,MEMS,CMOS,IC substrate,acoustics electronics...
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