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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
6 Years
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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [6]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [20]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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4Layer MicroSD card substrate production
4Layer MicroSD card substrate production
  • 4Layer MicroSD card substrate production
  • 4Layer MicroSD card substrate production
Products Detailed
Description Of IC Substrate pcb IC Package Substrate, IC Package Substrate, is a key carrier in the packaging and testing process, used to establish ...
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