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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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6 Years
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Home / Products / Memory Substrate / 4 Layer BT core memory substrate production /

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BGA Substrate

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IC Package Substrate

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Sip Package Substrate

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FCCSP Package Substrate

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Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
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4 Layer BT core memory substrate production
4 Layer BT core memory substrate production
  • 4 Layer BT core memory substrate production
  • 4 Layer BT core memory substrate production
Products Detailed
Description Of IC Substrate pcb IC substrate is the packaging substrate, developed on the basis of HDI board, is to adapt to the rapid development of ...
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