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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / Ultrathin Rigid PCB / NAND memory substrate ultrathin FR4 core BT raw material /

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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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NAND memory substrate ultrathin FR4 core BT raw material
NAND memory substrate ultrathin FR4 core BT raw material
  • NAND memory substrate ultrathin FR4 core BT raw material
  • NAND memory substrate ultrathin FR4 core BT raw material
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Description Of IC Substrate pcb Above IC substrate is a type of carry material for memory integrated circuit with internal circuit to connect the ...
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Product Tags:
superconducting thin monocrystalline substrate iteq pcb material multicrystalline silicon wafer

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