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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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Memory Substrate
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NAND memory package substrate manufacture
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Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
Visit Website
City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
View Contact Details
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NAND memory package substrate manufacture
Products Detailed
Application:NAND memory package,Memory electronics,storage electronics,Flash memory,FBGA/PBGA package,Semiconductor package; Spec.of pcb production: ...
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