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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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5 Years
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Home / Products / IC Package Substrate / JEDEC Standard eMCP IC Package Substrate Fabrication /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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JEDEC Standard eMCP IC Package Substrate Fabrication
JEDEC Standard eMCP IC Package Substrate Fabrication
  • JEDEC Standard eMCP IC Package Substrate Fabrication
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Application:Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card...
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