Precision 0.15mm IC Packaging Substrate fabrication
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Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR...
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0.2mm 2 layer Memory Card substrate Fabrication For Capsulation
Hitachi BT IC Package Substrate production supporting
AUS308 PSR IC Package substrate manufacture
0.15mm IC assembly package substrate For semiconductor package
4L build up types 0.8mm Gold Surface IC Package Substrate
Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation
Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR
Storage IC Package Substrate Pcb
DDR IC Package Substrate Pcb
HOREXS semiconductor ic package substrate With Chip Wire Bonding
Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
BGA IC Package Substrate With Cap Plated MGC BT material
Soft Gold Finished BOC Package Substrate High Speed High Density For Memory Chip
OEM ODM Gold Bonding IC Package Substrate 4 Layer
Soft Gold MCP / CSP Package Substrate BT FR4 0.1 - 0.4mm Finished Thickness
