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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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6 Years
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Home / Products / IC Package Substrate / OEM ODM Gold Bonding IC Package Substrate 4 Layer /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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OEM ODM Gold Bonding IC Package Substrate 4 Layer
OEM ODM Gold Bonding IC Package Substrate 4 Layer
  • OEM ODM Gold Bonding IC Package Substrate 4 Layer
  • OEM ODM Gold Bonding IC Package Substrate 4 Layer
  • OEM ODM Gold Bonding IC Package Substrate 4 Layer
Products Detailed
Application:IC substrate,IC packge pcb,IC/chip assembly,Memory card,TF card,UDP,SD card;Memory card,MicroSD card,MicroTF card,Memory card;Semiconducto...
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