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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
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5 Years
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Home / Products / IC Package Substrate / BGA IC Package Substrate With Cap Plated MGC BT material /

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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
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BGA IC Package Substrate With Cap Plated MGC BT material
BGA IC Package Substrate With Cap Plated MGC BT material
  • BGA IC Package Substrate With Cap Plated MGC BT material
  • BGA IC Package Substrate With Cap Plated MGC BT material
Products Detailed
Application:IC substrate;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable ...
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