HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
Home / Products / IC Package Substrate / HOREXS semiconductor ic package substrate With Chip Wire Bonding /

show pictures

Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
Visit Website
City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
Contact Now

HOREXS semiconductor ic package substrate With Chip Wire Bonding

HOREXS semiconductor ic package substrate With Chip Wire Bonding
  • HOREXS semiconductor ic package substrate With Chip Wire Bonding
  • HOREXS semiconductor ic package substrate With Chip Wire Bonding
Products Detailed
Application:Memory card,UDP,bonding PCB printed circuit boards;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly...
View Products Detailed →