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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

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0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
  • 0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
  • 0.2mm Thickness semiconductor assembly substrate microelectronics packaging substrate
Products Detailed
Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) ...
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