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HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS GROUP
Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate (25)
IC Package Substrate (47)
Sip Package Substrate (3)
FCCSP Package Substrate (8)
Sensors Substrate (3)
RF Module Substrate (2)
Memory Substrate (21)
MEMS Substrate (3)
IoT Substrate (3)
Other Ultrathin Substrate (8)
Ultrathin Rigid PCB (16)
Medical Equipment PCB (1)
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MicroLED/MniLED package substrate manufacture
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Product Categories
BGA Substrate
[25]
IC Package Substrate
[47]
Sip Package Substrate
[3]
FCCSP Package Substrate
[8]
Sensors Substrate
[3]
RF Module Substrate
[2]
Memory Substrate
[21]
MEMS Substrate
[3]
IoT Substrate
[3]
Other Ultrathin Substrate
[8]
Ultrathin Rigid PCB
[16]
Medical Equipment PCB
[1]
Contact Now
HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:
shenzhen
Country/Region:
china
Contact Person:
MrMark Liu
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MicroLED/MniLED package substrate manufacture
Products Detailed
High Precision Fine Pitch LED package substrate with Plating Silver 0.4mm finished BT thickness,ROHS passed Application:Led lighting,LED display,LED ...
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