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HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS GROUP

Manufacturer from China
Verified Supplier
5 Years
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BGA Substrate, IC Package Substrate

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BGA Substrate

 [25]

IC Package Substrate

 [47]

Sip Package Substrate

 [3]

FCCSP Package Substrate

 [8]

Sensors Substrate

 [3]

RF Module Substrate

 [2]

Memory Substrate

 [21]

MEMS Substrate

 [3]

IoT Substrate

 [3]

Other Ultrathin Substrate

 [8]

Ultrathin Rigid PCB

 [16]

Medical Equipment PCB

 [1]
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HongRuiXing (Hubei) Electronics Co.,Ltd.
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City:shenzhen
Country/Region:china
Contact Person:MrMark Liu
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Highlighted Products
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China BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG for sale

BT FR4 NAND Memory Substrate Board 35/35um 4 Layer ENEPIG

China Microelectronics IC substrate manufacture for sale

Microelectronics IC substrate manufacture

China BT semiconductor IC packaging substrate manufacture for sale

BT semiconductor IC packaging substrate manufacture

China MicroLED/MiniLED package substrate manufacture for sale

MicroLED/MiniLED package substrate manufacture

China MicroLED/MniLED package substrate manufacture for sale

MicroLED/MniLED package substrate manufacture

China Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap for sale

Horexs 0.2mm Thickness BGA package substrate full resin plug all holes and cap

China 0.28mm Finished Lead Free memory chip substrate manufacture for sale

0.28mm Finished Lead Free memory chip substrate manufacture

China LED chip ic package substrate manufacture supporting for sale

LED chip ic package substrate manufacture supporting

China OEM ODM semiconductor packaging substrate China mainland for sale

OEM ODM semiconductor packaging substrate China mainland

China microelectronics package substrate manufacture for sale

microelectronics package substrate manufacture

China 0.2mm 2 layer Memory Card substrate Fabrication For Capsulation for sale

0.2mm 2 layer Memory Card substrate Fabrication For Capsulation

China Hitachi BT IC Package Substrate production supporting for sale

Hitachi BT IC Package Substrate production supporting

China AUS308 PSR IC Package substrate manufacture for sale

AUS308 PSR IC Package substrate manufacture

China Precision 0.15mm IC Packaging Substrate fabrication for sale

Precision 0.15mm IC Packaging Substrate fabrication

China 0.15mm IC assembly package substrate For semiconductor package for sale

0.15mm IC assembly package substrate For semiconductor package

China 4L build up types 0.8mm Gold Surface IC Package Substrate for sale

4L build up types 0.8mm Gold Surface IC Package Substrate

China Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation for sale

Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation

China Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR for sale

Bright Gold 0.2mm Multilayer substrate Fabrication With AUS308 PSR

China Storage IC Package Substrate Pcb for sale

Storage IC Package Substrate Pcb

China wirebonding packaging memory substrate with soft gold plating for sale

wirebonding packaging memory substrate with soft gold plating

We Will Provide Quality BGA Substrate, IC Package Substrate, Sip Package Substrate

HongRuiXing (Hubei) Electronics Co.,Ltd. in China
HongRuiXing (Hubei) Electronics Co.,Ltd. in China
HongRuiXing (Hubei) Electronics Co.,Ltd. in China
HongRuiXing (Hubei) Electronics Co.,Ltd. in China
HongRuiXing (Hubei) Electronics Co.,Ltd. in China
HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS Group was located in CHINA mainland,has three subsidiaries:Boluo HongRuiXing Electronics Co., Ltd(Located in Huizhou city GuangDong),HongRuiXing (HuBei) Electronics Co.,Ltd(Located in HuBei province),Horexs...
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